Radiation effects in MIT Lincoln Lab 3DIC technology by Gouker, Pascale M., Wyatt, Peter W., Yost, Donna-Ruth W., Chen, Chenson K., Chen, Chang-Lee, Knecht, Jeffrey M., Keast, Craig L.

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Channel engineering of SOI MOSFETs for RF applications by Keast, Craig L., Wyatt, Peter W., Healey, Paul D., Yost, Donna-Ruth W., Gouker, Pascale M., Chen, Chenson K., Kedzierski, Jakub T., Knecht, Jeffrey M., Chen, Chang-Lee

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Wafer-scale 3D integration of silicon-on-insulator RF amplifiers by Keast, Craig L., Chen, Chang-Lee, Chen, Chenson K., Yost, Donna-Ruth W., Knecht, Jeffrey M., Wyatt, Peter W., Burns, James A., Warner, Keith, Gouker, Pascale M., Healey, Paul D., Wheeler, Bruce D.

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A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor by Suntharalingam, Vyshnavi, Berger, Robert, Clark, Stewart, Knecht, Jeffrey M., Messier, Andrew V., Newcomb, Kevin L., Rathman, Dennis D., Slattery, Richard L., Soares, Antonio M., Stevenson, Charles, Warner, Keith, Young, Douglas J., Ang, Lin Ping, Mansoorian, Barmak, Shaver, David C.

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Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits by Shaver, David C., Keast, Craig L., Wheeler, Bruce D., Hu, WeiLin, Bolkhovsky, Vladimir, Berger, Robert, Suntharalingam, Vyshnavi, Soares, Antonio M., Donnelly, Joseph P., Mahoney, Leonard J., Oakley, Douglas C., Chapman, David C., Knecht, Jeffrey M., Yost, Donna-Ruth W., Chen, Chang-Lee

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