Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint by Kumar, Aditya, Chen, Zhong

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Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple by Kumar, Aditya, Chen, Zhong

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Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder by Kumar, Aditya, He, Min, Chen, Zhong

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Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows by Mona, M., Chen, Zhong, Kumar, Aditya

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Energetic and exergetic study of a flat plate collector based solar water heater - investigation of the absorber size by Kumar Aditya Chandra, Bishal Podder, Supreme Das, Agnimitra Biswas

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Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations by Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong

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Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate by Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan

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Phase 4 Pharmacovigilance Trial of Paromomycin Injection for the Treatment of Visceral Leishmaniasis in India by Prabhat K. Sinha, T. K. Jha, Chandreshwar P. Thakur, Devendra Nath, Supriyo Mukherjee, Amrendra Kumar Aditya, Shyam Sundar

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