Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint by Kumar, Aditya, Chen, Zhong

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The effect of particle size on green pellet properties of iron ore fines by Satyananda Patra, Kumar Aditya, Rayasam Venugopal

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Energetic and exergetic study of a flat plate collector based solar water heater - investigation of the absorber size by Kumar Aditya Chandra, Bishal Podder, Supreme Das, Agnimitra Biswas

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Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations by Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong

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Defense Inducer Compounds Up-regulated the Peroxidase, Polyphenol Oxidase, and Total Phenol Activities against Spot Blotch Disease of Wheat by Puja Kumari, Chandrashekhar Azad, Ravi Ranjan Kumar, Jyoti Kumari, Kumar Aditya, Amarendra Kumar

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Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate by Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan

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