Leo Rafael Reif

Reif during the [[World Economic Forum|WEF]] 2013 Leo Rafael Reif (born August 21, 1950) is a Venezuelan American electrical engineer and academic administrator. He previously served as the 17th president of the Massachusetts Institute of Technology from 2012 to 2022, provost of the institute from 2005 to 2012, and dean of the institute's EECS department from 2004 to 2005.

Reif sits on the boards of the World Economic Forum, the Carnegie Endowment, the Council on Foreign Relations, and the Broad Institute. Provided by Wikipedia
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  1. 1
    Sputter deposition of aluminum nitride for applications in thin-film resonators

    Sputter deposition of aluminum nitride for applications in thin-film resonators by Naik, Rajan Sharad

    Published 2005
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  2. 2
    The effect of low energy ion bombardment on the crystallographic orientation of thin films

    The effect of low energy ion bombardment on the crystallographic orientation of thin films by Yu, Lock See

    Published 2005
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  3. 3
    Development of novel alternative chemistry processes for dielectric etch applications

    Development of novel alternative chemistry processes for dielectric etch applications by Karecki, Simon Martin

    Published 2005
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  4. 4
    A framework for analog circuit optimization

    A framework for analog circuit optimization by Mitros, Piotr, 1979-

    Published 2005
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  5. 5
    Carbon nanotube applications for CMOS back-end processing

    Carbon nanotube applications for CMOS back-end processing by Wu, Tan Mau, 1979-

    Published 2006
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  6. 6
    Crystallization in self-implanted polycrystalline silicon-on-insulator films

    Crystallization in self-implanted polycrystalline silicon-on-insulator films by Iverson, Ralph Benhart

    Published 2006
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  7. 7
    Non-perfluorocompound chemistries for plasma etching of dielectrics

    Non-perfluorocompound chemistries for plasma etching of dielectrics by Tao, Benjamin A. (Benjamin Albert)

    Published 2008
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  8. 8
    Vertical profile engineering and reliability study of silicon-germanium heterojunction bipolar transistors

    Vertical profile engineering and reliability study of silicon-germanium heterojunction bipolar transistors by Liao, Kenneth S. (Kenneth Sen-Chun)

    Published 2008
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  9. 9
    Alternative chemistries for etching of silicon dioxide and silicon nitride

    Alternative chemistries for etching of silicon dioxide and silicon nitride by Karecki, Simon Martin

    Published 2008
    Other Authors: “…L. Rafael Reif.…”
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    Thesis
  10. 10
    Characterization of chemical vapor deposited polycrystalline silicon thin films

    Characterization of chemical vapor deposited polycrystalline silicon thin films by Hajjar, Jean-Jacques Joseph

    Published 2005
    Other Authors: “…L. Rafael Reif and David Adler.…”
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    Thesis
  11. 11
    Metrology of very thin silicon epitaxial films

    Metrology of very thin silicon epitaxial films by Chen, Weize, 1966-

    Published 2005
    Other Authors: “…L. Rafael Reif and Lionel C. Kimerling.…”
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    Thesis
  12. 12
    Development of an architectural design tool for 3-D VLSI sensors

    Development of an architectural design tool for 3-D VLSI sensors by Tyrrell, Brian (Brian Matthew)

    Published 2006
    Other Authors: “…L. Rafael Reif and Robert K. Reich.…”
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    Thesis
  13. 13
    Multi-layer three-dimensional silicon electronics enabled by wafer bonding

    Multi-layer three-dimensional silicon electronics enabled by wafer bonding by Tan, Chuan Seng, Ph. D. Massachusetts Institute of Technology

    Published 2007
    Other Authors: “…L. Rafael Reif and Anantha P. Chandrakasan.…”
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    Thesis
  14. 14
    Three dimensional integration technology using copper wafer bonding

    Three dimensional integration technology using copper wafer bonding by Fan, Andy, 1976-

    Published 2008
    Other Authors: “…L. Rafael Reif and Akintunde Ibitayo Akinwande.…”
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    Thesis

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