Methods and Research Hotspots of Forensic Kinship Testing by Ran LI, Hong-yu SUN

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Strong Convergence of an Iterative Method for Equilibrium Problems and Variational Inequality Problems by Li HongZhi, Li HongYu

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Long non-coding RNA-2271 promotes osteogenic differentiation in human bone marrow stem cells by Xi Li-Cheng, Li Hong-Yu, Yin Dong

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Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV) by Lin, Ye, Li, Hong Yu, Tan, Chuan Seng

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Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization by Tan, Chuan Seng, Lim, Dau Fatt, Peng, Lan, Li, Hong Yu

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Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds by Tan, Chuan Seng, Peng, Lan, Fan, Ji, Li, Hong Yu, Gao, Shan

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Advanced 3D integration technologies in various quantum computing devices by Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Guidoni, Luca, Tan, Chuan Seng

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Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current by Zhang, Lin, Lim, Dau Fatt, Li, Hong Yu, Gao, Shan, Tan, Chuan Seng

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Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits by Made, Riko I., Lan, Peng, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng

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Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits by Made, Riko I., Peng, Lan, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng

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Design and fabrication of grating couplers for the optical addressing of trapped ions by Lim, Yu Dian, Li, Hong Yu, Zhao, Peng, Tao, Jing, Guidoni, Luca, Tan, Chuan Seng

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The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device by Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

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Recognizing beam profiles from silicon photonics gratings using a transformer model by Lim, Yu Dian, Li, Hong Yu, Goh, Simon Chun Kiat, Wang, Xiangyu, Zhao, Peng, Tan, Chuan Seng

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Real-time detection and auto-focusing of beam profiles from silicon photonics gratings using the YOLO model by Lim, Yu Dian, Li, Hong Yu, Goh, Simon Chun Kiat, Wang, Xiangyu, Zhao, Peng, Tan, Chuan Seng

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Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly by Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liangxing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

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Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects by Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu

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Surface-electrode ion trap with ground structures for minimizing the dielectric loss in the Si substrate by Tao, Jing, Li, Hong Yu, Lim, Yu Dian, Zhao, Peng, Apriyana, Anak Agung Alit, Guidoni, Luca, Tan, Chuan Seng

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CMOS-fabricated ring surface ion trap with TSV integration by Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Likforman, Jean-Pierre, Guidoni, Luca, Desormeaux, Lilay Gros, Tan, Chuan Seng

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Heating dissipation discussion of TSV-integrated ion trap with glass interposer by Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

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Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief by Ghosh, Kaushik, Zhang, Jiye, Zhang, Lin, Dong, Yuanwei, Li, Hong Yu, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng

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