Methods and Research Hotspots of Forensic Kinship Testing 由 Ran LI, Hong-yu SUN

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Strong Convergence of an Iterative Method for Equilibrium Problems and Variational Inequality Problems 由 Li HongZhi, Li HongYu

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Long non-coding RNA-2271 promotes osteogenic differentiation in human bone marrow stem cells 由 Xi Li-Cheng, Li Hong-Yu, Yin Dong

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Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV) 由 Lin, Ye, Li, Hong Yu, Tan, Chuan Seng

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Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization 由 Tan, Chuan Seng, Lim, Dau Fatt, Peng, Lan, Li, Hong Yu

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Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds 由 Tan, Chuan Seng, Peng, Lan, Fan, Ji, Li, Hong Yu, Gao, Shan

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Advanced 3D integration technologies in various quantum computing devices 由 Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Guidoni, Luca, Tan, Chuan Seng

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Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current 由 Zhang, Lin, Lim, Dau Fatt, Li, Hong Yu, Gao, Shan, Tan, Chuan Seng

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Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits 由 Made, Riko I., Lan, Peng, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng

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Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits 由 Made, Riko I., Peng, Lan, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng

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Design and fabrication of grating couplers for the optical addressing of trapped ions 由 Lim, Yu Dian, Li, Hong Yu, Zhao, Peng, Tao, Jing, Guidoni, Luca, Tan, Chuan Seng

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The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device 由 Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

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Recognizing beam profiles from silicon photonics gratings using a transformer model 由 Lim, Yu Dian, Li, Hong Yu, Goh, Simon Chun Kiat, Wang, Xiangyu, Zhao, Peng, Tan, Chuan Seng

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Real-time detection and auto-focusing of beam profiles from silicon photonics gratings using the YOLO model 由 Lim, Yu Dian, Li, Hong Yu, Goh, Simon Chun Kiat, Wang, Xiangyu, Zhao, Peng, Tan, Chuan Seng

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Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly 由 Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liangxing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

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Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects 由 Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu

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Surface-electrode ion trap with ground structures for minimizing the dielectric loss in the Si substrate 由 Tao, Jing, Li, Hong Yu, Lim, Yu Dian, Zhao, Peng, Apriyana, Anak Agung Alit, Guidoni, Luca, Tan, Chuan Seng

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CMOS-fabricated ring surface ion trap with TSV integration 由 Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Likforman, Jean-Pierre, Guidoni, Luca, Desormeaux, Lilay Gros, Tan, Chuan Seng

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Heating dissipation discussion of TSV-integrated ion trap with glass interposer 由 Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

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Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief 由 Ghosh, Kaushik, Zhang, Jiye, Zhang, Lin, Dong, Yuanwei, Li, Hong Yu, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng

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