Vision-based inspection of PCB soldering defects by Zailah W, Gan, B.Y.J., Leong, H.Y., Norsuzlin Mohd Sahar, Mohammad Tariqul Islam

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Stitch bond strength study in insulated Cu wire bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.

Characterisation of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.

Development of insulated cu wire stitch bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Faiz, M.

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In-depth study and characterization of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.

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