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Leong, Hoi Liong
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Author
Leong, Hoi Liong
Showing
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Leong, Hoi Liong
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1
Quantitative analysis of the mechanical and electrical properties of Cu-Cu bonds for three-dimensional integrated circuits (3D ICs)
by
Leong, Hoi Liong
Published 2008
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2
Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects
by
Leong, Hoi Liong
,
Gan, C.L.
,
Pey, Kin Leong
,
Thompson, Carl V.
,
Li, Hongyu
Published 2005
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Article
3
Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits
by
Leong, Hoi Liong
,
Gan, C.L.
,
Pey, Kin Leong
,
Tsang, Chi-fo
,
Thompson, Carl V.
,
Hongyu, Li
Published 2004
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