Non-linear representation of voltage sag profiles for fault location in distribution networks by Mokhlis, Hazlie, Li, H.Y.

Fault location estimation for distribution system using simulated voltage sags data by Mokhlis, Hazlie, Li, H.Y.

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Seasonal population dynamics of the monogeneans Quadriacanthus kobinensis parasitising Clarias fuscus in Pearl River, China by Hu J. J., Li H. Y.

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Ethical Problems and Countermeasures of Artificial Intelligence Technology by Li H Y, An J T, Zhang Y

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Mitosis-targeted anti-cancer therapies : where they stand by Chan, K.-S., Li, H.-Y., Koh, Cheng Gee

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The application of voltage sags pattern to locate a faulted section in distribution network by Mokhlis, Hazlie, Li, H.Y., Khalid, A.R.

Development of automated fault location software for distribution network by Mokhlis, Hazlie, Khalid, A.R., Li, H.Y.

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Voltage sags matching to locate faults for underground distribution networks by Mokhlis, Hazlie, Mohamad, H., Li, H.Y., Abu Bakar, A.

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Evaluation of fault location based on voltage sags profiles: a study on the influence of voltage sags patterns by Mokhlis, Hazlie, Mohamad, H., Bakar, A.H.A., Li, H.Y.

A comprehensive fault location estimation using voltage sag profile for non-homogenous distribution networks by Mokhlis, Hazlie, Li, H.Y., Mohamad, H., Bakar, A.H.A.

Locating fault using voltage sags profile for underground distribution system by Mokhlis, Hazlie, Li, H.Y., Bakar, A.H.A., Mohamad, H.

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Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking by Peng, L., Li, H. Y., Fan, Ji, Gao, Shan, Tan, Chuan Seng

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Mechanisms of dwell fatigue crack growth in an advanced nickel disc alloy RR1000 by Yu S.Y., Li H.Y., Hardy M.C., McDonald S.A., Bowen P.

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Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking by Peng, L., Zhang, L., Li, H. Y., Fan, Ji, Lim, Dau Fatt, Tan, Chuan Seng

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Nanotechnology and material engineering research : selected, peer reviewed papers from the 2012 International Conference on Nanotechnology and Future Material Engineering (NFME2013... by International Conference on Nanotechnology and Future Material Engineering (2013 : Wuhan, China), Xu, B., editor, Li, H. Y., editor

Operating TSV in stable accumulation capacitance region by utilizing Al2O3-induced negative fixed charge by Zhang, L., Li, H. Y., Peng, L., Lo, Guo-Qing, Kwong, Dim Lee, Tan, Chuan Seng

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Materials in industry and nanotechnology : selected, peer reviewed papers from the 2013 2nd International Conference on Function Materials and Nanotechnology (FMN2013), July 13-14,... by International Conference on Function Materials and Nanotechnology (2nd : 2013 : Nanchang, China), Xu, B., editor, Li, H. Y., editor

Building materials and structural engineering II : selected, peer reviewed papers from the 2013 2nd international conference on building materials and structural engineering (BMSE2... by International Conference on Building Materials and Structural Engineering (2nd : 2013 : Beijing, China), Xu, B., editor, Li, H. Y., editor

Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects by Made, Riko I., Thompson, Carl V., Leong, H. L., Li, H. Y., Gan, Chee Lip, Pey, Kin Leong

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Research on mechanics, dynamic systems and material engineering : selected peer reviewed papers from the 2012 international conference on mechanics, dynamic systems and material en... by International conference on mechanics, dynamic systems and material engineering (MDSME2012) (2012 : Guangzhou, China), Xu, B., editor, Li, H. Y., editor