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    Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer

    Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer by Xiaoli Wang, Chau-Chang Chou, Liberty Tse-Shu Wu, Rudder Wu, Jyh-Wei Lee, Horng-Yi Chang

    Published 2021-05-01
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