Low temperature three dimensional wafer level copper thermo-compression bonding by Lim, Dau Fatt.

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Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization by Tan, Chuan Seng, Lim, Dau Fatt, Peng, Lan, Li, Hong Yu

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Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation by Peng, L., Leong, K. C., Lim, Dau Fatt, Fan, Ji, Tan, Chuan Seng

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Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current by Zhang, Lin, Lim, Dau Fatt, Li, Hong Yu, Gao, Shan, Tan, Chuan Seng

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Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking by Peng, L., Zhang, L., Li, H. Y., Fan, Ji, Lim, Dau Fatt, Tan, Chuan Seng

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Single-mode surface-emitting concentric-circular-grating terahertz quantum cascade lasers by Liang, Guozhen, Liang, Houkun, Zhang, Ying, Khanna, Suraj P., Li, Lianhe, Davies, A. Giles, Linfield, Edmund, Lim, Dau Fatt, Tan, Chuan Seng, Yu, Siu Fung, Liu, Hui Chun, Wang, Qi Jie

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Single-mode narrow beam divergence surface-emitting concentric-circular-grating terahertz quantum cascade lasers by Khanna, Suraj P., Liang, Guozhen, Liang, Houkun, Zhang, Ying, Li, Lianhe, Davies, A. Giles, Linfield, Edmund, Lim, Dau Fatt, Tan, Chuan Seng, Yu, Siu Fung, Liu, Hui Chun, Wang, Qi Jie

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