Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via by Lin, Ye

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Modeling, fabrication, and characterization of 3-D capacitor embedded in through-silicon via by Lin, Ye, Tan, Chuan Seng

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Dielectric quality of 3D capacitor embedded in through-silicon via (TSV) by Lin, Ye, Tan, Chuan Seng

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Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias by Lin, Ye, Tan, Chuan Seng

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Leakage current conduction mechanism in 3D capacitor embedded in Through-Silicon Via (TSV) by Lin, Ye, Tan, Chuan Seng

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Analysis of tanker freight market and forecasting of future market movement by Bao, Lin Ye, Xu, Peng, Zhang, You Wen

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Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV) by Lin, Ye, Li, Hong Yu, Tan, Chuan Seng

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RF characterization and design of multi-TSV with embedded capacitor by Panwar, Neeraj, Apriyana, Anak Agung Alit, Lin, Ye, Tan, Chuan Seng

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Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications by Lin, Ye, Apriyana, Anak Agung Alit, Hong, Yu Li, Tan, Chuan Seng

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Design and development of single-qubit ion trap on glass and Si substrates with RF analysis and performance benchmarking by Apriyana, Anak Agung Alit, Li, Hong Yu, Zhao, Peng, Tao, Jing, Lim, Yu Dian, Lin, Ye, Guidoni, Luca, Tan, Chuan Seng

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