Author Search Results :: UTM Library Massive Scholar Tracking

1

Development of LED Package Heat Dissipation Research by Peisheng Liu, Chenhui She, Lipeng Tan, Pengpeng Xu, Lei Yan

Published 2022-01-01

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2

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP by Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan, Zhao Zhang

Published 2023-06-01

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3

Research on Heat Dissipation of Multi-Chip LED Filament Package by Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, Hui Quan

Published 2021-12-01

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4

Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling by Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, Hui Quan

Published 2022-03-01

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