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Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging -н He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense

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Effects of CrMnFeCoNi additions on microstructure, mechanical properties and wear resistance of Ti(C,N)-based cermets -н Yang, Shandong, Xiong, Ji, Guo, Zhixing, Wu, Biao, Yang, Tian'en, You, Qianbing, Liu, Junbo, Deng, Chengjun, Fang, Ding, Gou, Shaoxuan, Yu, Ze, Chen, Sitao

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