Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints by M.A., Rabiatul Adawiyah, O., Saliza Azlina

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Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper by M.A., Rabiatul Adawiyah, O., Saliza Azlina

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate by M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg by M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir