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High-speed PCB circuit power integrity simulation analysis by Meng Xiangsheng, Che Kai, Li Xiaofeng, Li Jiufa, Li Suxuan, He Xueqin
Published 2019-09-01
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Processable polyimide resins and their composites for long-term application at 300 ℃ by HU Hai, MENG Xiangsheng, KE Hongjun, WANG Xianwei, LI Xianming, GONG Dirong, WANG Zhen
Published 2023-09-01
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