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    Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure

    Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure by Lam, Jeffrey C. K., Huang, Maggie Y. M., Ng, Tsu Hau, Mohammed Khalid Dawood, Zhang, Fan, Du, Anyan, Sun, Handong, Shen, Zexiang, Mai, Zhihong

    Published 2013
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    Journal Article

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