ZINC MICRO-ALLOYING ADDITIONS IN Sn-0.7Cu LEAD-FREE SOLDER ALLOYS. SHORT REVIEW by Intan Nashasha Amira IBRAHIM, MOHD Arif Anuar MOHD SALLEH

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EFFECT OF BISMUTH CONTENT ON MICROSTRUCTURE, MELTING TEMPERATURE AND UNDERCOOLING OF SN-0.7CU SOLDER ALLOY by Mohd Izrul Izwan RAMLI, Muhamad Syafiq Syakri YUSUF, Mohd Arif Anuar MOHD SALLEH

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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Mohd Izrul Izwan Ramli

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Effect of LST parameter on surface morphology of modified copper substrates by Siti Faqihah, Roduan, Juyana, A. Wahab, Mohd Arif Anuar, Mohd Salleh, Nurul Aida Husna, Mohd Mahayuddin, Aiman, Mohd Halil, M., Ishak

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Micromechanical Modeling of Polyamide 11 Nanocomposites Properties using Composite Theories by Khairul Anwar Abdul Halim, James E. Kennedy, Mohd Arif Anuar Mohd Salleh, Azlin Fazlina Osman, Mohd Firdaus Omar, N.M. Sunar

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Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process by Muhammad Iqbal Ahmad, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Mohd Arif Anuar Mohd Salleh, Mohammad Hafifi Hafiz Ishak, Wan Rahiman, Marcin Nabiałek

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The Investigation of Ground Granulated Blast Furnace Slag Geopolymer at High Temperature by Using Electron Backscatter Diffraction Analysis by Ikmal Hakem Aziz, Mohd Mustafa Al Bakri Abdullah, Mohd Arif Anuar Mohd Salleh, Sorachon Yoriya, Rafiza Abd Razak, Rosnita Mohamed, Madalina Simona Baltatu

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The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek

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Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substrate by Warid Wazien Ahmad Zailani, Aissa Bouaissi, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Sorachon Yoriya, Mohd Arif Anuar Mohd Salleh, Mohd Remy Rozainy M. A. Z., Hamzah Fansuri

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Characterization of SnO 2/TiO 2 with the Addition of Polyethylene Glycol via Sol-Gel Method for Self-Cleaning Application by Dewi Suriyani Che Halin, A. Azliza, Kamrosni Abdul Razak, Mohd Mustafa Albakri Abdullah, Mohd Arif Anuar Mohd Salleh, Juyana A Wahab, V. Chobpattana, L. Kaczmarek, M. Nabiałek, B. Jeż

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Alkaline-Activation Technique to Produce Low-Temperature Sintering Activated-HAp Ceramic by Wan Mohd Arif W. Ibrahim, Mohd Mustafa Al Bakri Abdullah, Noorina Hidayu Jamil, Hasmaliza Mohamad, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Petrica Vizureanu, Madalina Simona Baltatu, Patimapon Sukmak

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Diverse material based geopolymer towards heavy metals removal: a review by Pilomeena Arokiasamy, Mohd Mustafa Al Bakri Abdullah, Shayfull Zamree Abd Rahim, Monower Sadique, Liew Yun Ming, Mohd Arif Anuar Mohd Salleh, Mohd Remy Rozainy Mohd Arif Zainol, Che Mohd Ruzaidi Ghazali

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Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging In... by Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan), Nogita, Kauhiro, editor, Mohd. Arif Anuar Mohd. Salleh, editor, Mohd. Mustafa Al Bakri Abdullah, editor, Liyana Jamaludin, editor, Muhammad Faheem Mohd. Tahir, editor

Microstructure Evolution of Ag/TiO₂ Thin Film by Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Mohd Mustafa Al Bakri Abdullah, Ayu Wazira Azhari, Kazuhiro Nogita, Hideyuki Yasuda, Marcin Nabiałek, Jerzy J. Wysłocki

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Metakaolin/sludge based geopolymer adsorbent on high removal efficiency of Cu2+ by Pilomeena Arokiasamy, Mohd Mustafa Al Bakri Abdullah, Shayfull Zamree Abd Rahim, Mohd Remy Rozainy Mohd Arif Zainol, Mohd Arif Anuar Mohd Salleh, Marwan Kheimi, Jitrin Chaiprapa, Andrei Victor Sandu, Petrica Vizureanu, Rafiza Abdul Razak, Noorina Hidayu Jamil

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Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy by Siti Faqihah, Roduan, Juyana, A. Wahab, Mohd Arif Anuar, Mohd Salleh, Nurul Aida Husna, Mohd Mahayuddin, Mohd Mustafa, Al Bakri Abdullah, Aiman, Mohd Halil, Amira Qistina Syamimi, Zaifuddin, Mahadzir, Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica

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Innovative Materials and Technologies / by Ramadhansyah Putra Jaya, author, Mohd. Rosli Hainin, author, Norzita Ngadi, author, Mohd. Mustafa Al Bakri Abdullah, author, Mohd. Mustafa Al Bakri Abdullah, editor, Zarina Yahya, editor, Mohd. Arif Anuar Mohd. Salleh, editor, Wan Nur Aifa Wan Azahar, author, Mastura Bujang, author

Sustainable materials : International Conference on Sustainable Materials (ICoSM 2018) : selected, peer reviewed papers from the International Conference on Sustainable Materials (... by International Conference on Sustainable Materials (ICoSM) 2018 : Bangkok, Thailand, Heah, Cheng Yong, editor, Mohd. Arif Anuar Mohd. Salleh, editor, Mohd. Firdaus Omar, editor, Sharifah Shahnaz Syed Bakar, editor, Farah Farhana Zainal, editor, Dewi Suriyani Che Halin, editor, Liew, Yung Ming, editor, Khairel Rafezi Ahmad, editor, Mohd. Mustafa Al Bakri Abdullah, editor