EFFECT OF BISMUTH CONTENT ON MICROSTRUCTURE, MELTING TEMPERATURE AND UNDERCOOLING OF SN-0.7CU SOLDER ALLOY by Mohd Izrul Izwan RAMLI, Muhamad Syafiq Syakri YUSUF, Mohd Arif Anuar MOHD SALLEH

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MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY by Mohd Izrul Izwan RAMLI, Rita MOHD SAID, Flora SOMIDIN, Siti Farahnabilah MUHD AMLI, Siti Nor Atirah MUSTAPHA

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Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Siti Farahnabilah Muhd Amli, Nurul Razliana Abdul Razak

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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Mohd Izrul Izwan Ramli

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OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS by Mohd Izrul Izwan RAMLI, Siti Farahnabilah MUHD AMLI, Norainiza SAUD, Dewi Suriyani CHE HALIN, Nur Akrimi Maswa MD FAUZI

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The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek

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Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Nur Syahirah Mohamad Zaimi, Andrei Victor Sandu, Petrica Vizureanu, Adam Rylski, Siti Farahnabilah Muhd Amli

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Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Mohd Mustafa Al Bakri Abdullah, Norainiza Saud, Shayfull Zamree Abd Rahim, Petrica Vizureanu, Rita Mohd Said, Mohd Izrul Izwan Ramli

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Microstructure Evolution of Ag/TiO₂ Thin Film by Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Mohd Mustafa Al Bakri Abdullah, Ayu Wazira Azhari, Kazuhiro Nogita, Hideyuki Yasuda, Marcin Nabiałek, Jerzy J. Wysłocki

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Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al-Bakri Abdullah, Nur Izzati Muhammad Nadzri, Andrei Victor Sandu, Petrica Vizureanu, Mohd Izrul Izwan Ramli, Kazuhiro Nogita, Hideyuki Yasuda, Ioan Gabriel Sandu

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Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Siti Farahnabilah Muhd Amli, Rita Mohd Said, Norainiza Saud, Mohd Mustafa Al Bakri Abdullah, Petrica Vizureanu, Adam Rylski, Jitrin Chaiprapa, Marcin Nabialek

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The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Ikmal Hakem Aziz, Tan Chi Ying, Noor Fifinatasha Shahedan, Winfried Kockelmann, Anna Fedrigo, Andrei Victor Sandu, Petrica Vizureanu, Jitrin Chaiprapa, Dumitru Doru Burduhos Nergis

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