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EFFECT OF BISMUTH CONTENT ON MICROSTRUCTURE, MELTING TEMPERATURE AND UNDERCOOLING OF SN-0.7CU SOLDER ALLOY by Mohd Izrul Izwan RAMLI, Muhamad Syafiq Syakri YUSUF, Mohd Arif Anuar MOHD SALLEH

Published 2018-12-01

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MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY by Mohd Izrul Izwan RAMLI, Rita MOHD SAID, Flora SOMIDIN, Siti Farahnabilah MUHD AMLI, Siti Nor Atirah MUSTAPHA

Published 2023-06-01

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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Mohd Izrul Izwan Ramli

Published 2023-09-01

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OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS by Mohd Izrul Izwan RAMLI, Siti Farahnabilah MUHD AMLI, Norainiza SAUD, Dewi Suriyani CHE HALIN, Nur Akrimi Maswa MD FAUZI

Published 2023-03-01

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The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek

Published 2021-02-01

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Microstructure Evolution of Ag/TiO<sub>2</sub> Thin Film by Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Mohd Mustafa Al Bakri Abdullah, Ayu Wazira Azhari, Kazuhiro Nogita, Hideyuki Yasuda, Marcin Nabiałek, Jerzy J. Wysłocki

Published 2021-01-01

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