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Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process by Muhammad Iqbal Ahmad, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Mohd Arif Anuar Mohd Salleh, Mohammad Hafifi Hafiz Ishak, Wan Rahiman, Marcin Nabiałek
Published 2021-07-01
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Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis by Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Hideyuki Yasuda, Kazuhiro Nogita, Mohd Mustafa Al Bakri Abdullah, Ovidiu Nemes, Andrei Victor Sandu, Petrica Vizureanu
Published 2023-06-01
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