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    Reduction of Thermal Conductivity through the Dispersion of TIC Nanoparticles into a p-Type BI0.5SB1.5TE3 Alloy by Ball Milling and Spark Plasma Sintering

    Reduction of Thermal Conductivity through the Dispersion of TIC Nanoparticles into a p-Type BI0.5SB1.5TE3 Alloy by Ball Milling and Spark Plasma Sintering by Cheenepalli Nagarjuna, Babu Madavali, Myeong-Won Lee, Suk-Min Yoon, Soon-Jik Hong

    Published 2019-06-01
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