Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density by Myeongho Park, Bin Yoo, Myeonghwan Hong, Daeun Cho, Yunjin Jeong, Cheolheon Park, Jaemin Kim, Tae-Min Ha, Garam Kim, Sang Jeen Hong, Daewon Lee

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