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    Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

    Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks by Jeongah Kim, Bo-Young Kim, Seong Dae Park, Ji-Hun Seo, Chan-Jae Lee, Myong Jae Yoo, Youngmin Kim

    Published 2021-08-01
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