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    Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

    Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining by Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, Katsuaki Suganuma

    Published 2019-10-01
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