Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints by M.A., Rabiatul Adawiyah, O., Saliza Azlina

Get full text

Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper by M.A., Rabiatul Adawiyah, O., Saliza Azlina

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate by M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes by M.A. Azmah Hanim, A. Ourdjini, I. Siti Rabiatull Aisha, O. Saliza Azlina

Get full text

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish by K., Vidyatharran, M. A., Azmah Hanim, Dele-Afolabi, T. T., Matori, K. A., O., Saliza Azlina

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish by M. A., Azmah Hanim, N., Muhamad Kamil, Wei, Chuan Khang, T. T., Dele‑Afolabi, O., Saliza Azlina

Get full text

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish by Dele-Afolabi, T. T., M. A., Azmah Hanim, K., Vidyatharran, K. A., Matori, O., Saliza Azlina, R., Calin

Get full text

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish by Dele-Afolabi, Temitope T., Hanim, M. A. Azmah, Vidyatharran, K., Amin Matori, Khamirul Amin, O. Saliza, Azlina, Recep, Çalin

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg by M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir