The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish by Osman, Saliza Azlina, Ourdjini, Ali, Mohamed Ariff, Azmah Hanim

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Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina

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Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina

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Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging by Mat Hussin, Nur Liyana, Mohamed Ariff, Azmah Hanim, Sulaiman, Shamsuddin, Osman, Saliza Azlina

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Shear analysis of rice husk ash RHA reinforced tin- 0.7-copper composite solders on electroless nickel/immersion silver ENIAg surfaces by Mohamed Ariff, Azmah Hanim, Chuan, Khang Wei, Temitope T., Dele-Afolabi, Osman, Saliza Azlina

Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish by Mohamed Anuar, Rabiatul Adawiyah, Hamidin, Mohamad Shahrom, Osman, Saliza Azlina, Othman, Mohamad Hilmi

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Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process by Fauzi, Muhamad Razizy, Amiruddin, Nurul Amira, Osman, Saliza Azlina, Mohamed Anuar, Rabiatul Adawiyah

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Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish by Mohamed Ariff, Azmah Hanim, N., Muhamad Kamil, Wei, Chuan Khang, Temitope T., Dele-Afolabi, Osman, Saliza Azlina

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Effect of etching as pre-treatment for electroless copper plating on silicon wafer by Mior Shahidina, Shazatul Akmaliah, Fadila, Nor Akmal, Yusopa, Mohd Zamri, Tamina, Mohd Nasir, Osman, Saliza Azlina