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Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys by ANGELA J. VASCONCELOS, RAFAEL H. KIKUCHI, ANDRÉ S. BARROS, THIAGO A. COSTA, MARCELINO DIAS, ANTONIO L. MOREIRA, ADRINA P. SILVA, OTÁVIO L. ROCHA
Published 2016-06-01
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