Integrated silicon pressure sensors using wafer bonding technology by Parameswaran, Lalitha

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Silicon pressure sensor using wafer bonding technology by Parameswaran, Lalitha

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Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering by Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M, Velásquez-García, Luis F

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Densification of Ionic Liquid Electrospray Thrusters using Silicon-Based MEMS Fabrication by Corrado, Matthew N., Lozano, Paulo C., Parameswaran, Lalitha, Cook, Matthew, Holihan, Eric C., Mathews, Richard, Racz, Livia M., Smith, Melissa A.

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Performance Characterization of High-Density Electrospray Thrusters by Corrado, Matthew N., Wangari, Charity, Finch, Michael R., Parameswaran, Lalitha, Cook, Matthew, Holihan, Eric C., Mathews, Richard, Kedzierski, Jakub, Racz, Livia M., Smith, Melissa A., Lozano, Paulo C.

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Scattering of long wavelengths into thin silicon photovoltaic films by plasmonic silver nanoparticles by Osgood, Richard M., Bullion, K. M., Giardini, S. A., Carlson, J. B., Stenhouse, P., Jeffrey, F., Braymen, S., Gill, H. Singh, Kumar, J., Kingsborough, Richard P., Liberman, Vladimir, Parameswaran, Lalitha, Rothschild, Mordechai, Miller, Owen D., Kooi, Steven Earl, Joannopoulos, John D.

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