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Paulo J. Ferreira
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Paulo J. Ferreira
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Paulo J. Ferreira
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1
The Effect of Ultrasonic Agitation on the Seedless Growth of Cu on Ru-W Thin Films
by
Rúben F. Santos
,
Bruno M. C. Oliveira
,
Paulo J. Ferreira
,
Manuel F. Vieira
Published 2022-12-01
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Article
2
Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis
by
Bruno M. C. Oliveira
,
Ruben F. Santos
,
Ana P. Piedade
,
Paulo J. Ferreira
,
Manuel F. Vieira
Published 2022-05-01
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Article
3
Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects
by
Rúben F. Santos
,
Bruno M. C. Oliveira
,
Liliane C. G. Savaris
,
Paulo J. Ferreira
,
Manuel F. Vieira
Published 2022-02-01
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Article
4
CHARACTERIZATION OF Eucalyptus grandis KRAFT PULPS TREATED WITH PHOSPHONATES IN DIFFERENT STAGES OF TCF BLEACHING
by
Maria Cristina Area
,
Fernando E. Felissia
,
M. Graca V. S. Carvalho
,
Paulo J. Ferreira
,
Olga M. Barboza
,
Dora I Benoechea
Published 2011-04-01
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Article
5
A New Approach for the Modification of Paper Surface Properties Using Polyoxometalates
by
José L. Amaral
,
Bruno M. Reis
,
António P. Mendes de Sousa
,
José A. F. Gamelas
,
Mikhail S. Saraiva
,
Paulo J. Ferreira
Published 2010-01-01
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Article
6
Seedless Cu Electroplating on Co-W Thin Films in Low pH Electrolyte: Early Stages of Formation
by
Rúben F. Santos
,
Bruno M. C. Oliveira
,
Alexandre Chícharo
,
Pedro Alpuim
,
Paulo J. Ferreira
,
Sónia Simões
,
Filomena Viana
,
Manuel F. Vieira
Published 2021-07-01
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Article
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