Effect of Solder Layer Void Damage on the Temperature of IGBT Modules by Pengpeng Xu, Peisheng Liu, Lei Yan, Zhao Zhang

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Mesenchymal stem cells: Emerging concepts and recent advances in their roles in organismal homeostasis and therapy by Peisheng Liu, Peisheng Liu, Peisheng Liu, Yongqian An, Ting Zhu, Ting Zhu, Ting Zhu, Siyuan Tang, Siyuan Tang, Xiaoyao Huang, Xiaoyao Huang, Shijie Li, Shijie Li, Fei Fu, Fei Fu, Ji Chen, Ji Chen, Kun Xuan, Kun Xuan

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Development of LED Package Heat Dissipation Research by Peisheng Liu, Chenhui She, Lipeng Tan, Pengpeng Xu, Lei Yan

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Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP by Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan, Zhao Zhang

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Research on Heat Dissipation of Multi-Chip LED Filament Package by Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, Hui Quan

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Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling by Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, Hui Quan

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Cacna2d2 inhibits axonal regeneration following surgical decompression in a rat model of cervical spondylotic myelopathy by Peisheng Liu, Xiaofeng Li, Jing Liu, Hengjia Zhang, Zhitao You, Jianfeng Zhang

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Amyloid-mediated remineralization for tooth hypoplasia of cleidocranial dysplasia by Xiaohe Guo, Xiaoxue Yang, Peisheng Liu, Xiaoyao Huang, Yang Gu, Hao Guo, Kun Xuan, Anqi Liu, Anqi Liu

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