Showing 1 - 17 results of 17 for search 'Po Ning', query time: 1.98s Refine Results
  1. 1
    A student's guide to coding and information theory /

    A student's guide to coding and information theory / by Moser, Stefan M., Chen, Po-Ning

    Published c201
  2. 2
    An Estimation Model of the Ultimate Shear Strength of Root-Permeated Soil, Fully Considering Interface Bonding

    An Estimation Model of the Ultimate Shear Strength of Root-Permeated Soil, Fully Considering Interface Bonding by Po Ning, Xin Xia, Yuanjun Jiang

    Published 2023-04-01
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  3. 3
    On Decoder Ties for the Binary Symmetric Channel with Arbitrarily Distributed Input

    On Decoder Ties for the Binary Symmetric Channel with Arbitrarily Distributed Input by Ling-Hua Chang, Po-Ning Chen, Fady Alajaji

    Published 2023-04-01
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  4. 4
    Research on the Early Warning Model for Pipelines Due to Landslide Geohazards under Multiple Influencing Factors

    Research on the Early Warning Model for Pipelines Due to Landslide Geohazards under Multiple Influencing Factors by Po Ning, Yuan-jun Jiang, Jun-jie Tang, Qi-jun Xie

    Published 2023-02-01
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  5. 5
    Transformation of Binary Linear Block Codes to Polar Codes With Dynamic Frozen

    Transformation of Binary Linear Block Codes to Polar Codes With Dynamic Frozen by Chien-Ying Lin, Yu-Chih Huang, Shin-Lin Shieh, Po-Ning Chen

    Published 2020-01-01
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  6. 6
    Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

    Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps by Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, K. N. Tu, Chih Chen

    Published 2021-10-01
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  7. 7
    Failures of Cu-Cu Joints under Temperature Cycling Tests

    Failures of Cu-Cu Joints under Temperature Cycling Tests by Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, Nien-Ti Tsou, Chih Chen

    Published 2022-07-01
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  8. 8
    Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping

    Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping by I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, K.N. Tu, Chih Chen

    Published 2021-05-01
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  9. 9
    Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling

    Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling by Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, Chih Chen

    Published 2021-09-01
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  10. 10
    Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

    Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints by Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, Chih Chen

    Published 2022-10-01
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  11. 11
    Dynamic Analysis of a Long Run-Out Rockslide Considering Dynamic Fragmentation Behavior in Jichang Town: Insights from the Three-Dimensional Coupled Finite-Discrete Element Method

    Dynamic Analysis of a Long Run-Out Rockslide Considering Dynamic Fragmentation Behavior in Jichang Town: Insights from the Three-Dimensional Coupled Finite-Discrete Element Method by Chun Zhu, Zhipeng Li, Yiding Bao, Po Ning, Xin Zhou, Meng Wang, Hong Wang, Wenbing Shi, Bingbing Chen

    Published 2023-12-01
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  12. 12
    Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

    Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints by Jia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, Kai-Cheng Shie, Po-Ning Hsu, Nien‑Ti Tsou, Chih Chen

    Published 2022-07-01
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  13. 13
    A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu

    A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu by Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, Po-Ning Hsu, Nien-Ti Tsou, K.N. Tu, Chih Chen

    Published 2021-09-01
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  14. 14
    To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints

    To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints by Yan-Rong Huang, Dinh-Phuc Tran, Po-Ning Hsu, Shih-Chi Yang, A.M. Gusak, K.N. Tu, Chih Chen

    Published 2023-05-01
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  15. 15
    The Clinical Effects of Pixel CO<sub>2</sub> Laser on Bladder Neck and Stress Urinary Incontinence

    The Clinical Effects of Pixel CO<sub>2</sub> Laser on Bladder Neck and Stress Urinary Incontinence by Cheng-Yu Long, Jennifer Po-Ning Lee, Zi-Xi Loo, Yi-Yin Liu, Chang-Lin Yeh, Chien-Wei Feng, Kun-Ling Lin

    Published 2022-08-01
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  16. 16
    Mapping Oxidation and Wafer Cleaning to Device Characteristics Using Physics-Assisted Machine Learning

    Mapping Oxidation and Wafer Cleaning to Device Characteristics Using Physics-Assisted Machine Learning by Sparsh Pratik, Po-Ning Liu, Jun Ota, Yen-Liang Tu, Guan-Wen Lai, Ya-Wen Ho, Zheng-Kai Yang, Tejender Singh Rawat, Albert S. Lin

    Published 2022-01-01
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  17. 17
    Artificial intelligence deep learning for 3D IC reliability prediction

    Artificial intelligence deep learning for 3D IC reliability prediction by Po-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, Jing-Chen Tu, Cheng-Che Wu, Nien-Ti Tsou, Yu-Chieh Lo, Nan-Yow Chen, Yong-Fen Hsieh, Mia Wu, Chih Chen, King-Ning Tu

    Published 2022-04-01
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