Particle packing theory guided multiscale alumina filled epoxy resin with excellent thermal and dielectric performances per Qi-Kun Feng, Chang Liu, Dong-Li Zhang, Yan-Hui Song, Kai Sun, Hai-Ping Xu, Zhi-Min Dang

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A Bilayer High-Temperature Dielectric Film with Superior Breakdown Strength and Energy Storage Density per Jiang-Bo Ping, Qi-Kun Feng, Yong-Xin Zhang, Xin-Jie Wang, Lei Huang, Shao-Long Zhong, Zhi-Min Dang

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Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites per Dong-Li Zhang, Sheng-Nan Liu, Hui-Wu Cai, Qi-Kun Feng, Shao-Long Zhong, Jun-Wei Zha, Zhi-Min Dang

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AI safety of film capacitors per Yong‐Xin Zhang, Fang‐Yi Chen, Di‐Fan Liu, Jian‐Xiao Wang, Qi‐Kun Feng, Hai‐Yang Jiang, Xin‐Jie Wang, Hong‐Bo Zhao, Shao‐Long Zhong, Faisal Mehmood Shah, Zhi‐Min Dang

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Data sonification of film capacitors per Yong‐Xin Zhang, Di‐Fan Liu, Xin‐Yi Wei, Xin‐Jie Wang, Fang‐Yi Chen, Qi‐Kun Feng, Wen‐Yuan Cao, Wen‐Zhuo Dong, Faisal Mehmood Shah, Yu‐Xiao Liu, Zhi‐Yuan Wu, Jian‐Tao Wang, Shao‐Long Zhong, Zhi‐Min Dang

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