Study of Rotation Speed Curve Optimization under the Three-Body Coupling Grinding Mode by Wei Yu, Binghai Lyu, Qianfa Deng, Chengwu Wang

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Orthogonal experimental study on the influence of machining parameters on flat lapping of sapphire substrate by Sheng Wang, Jiahong Ruan, Shihao Xiao, Qianfa Deng, Tianchen Zhao

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Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate by Tianchen Zhao, Julong Yuan, Qianfa Deng, Kaiping Feng, Zhaozhong Zhou, Xu Wang

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Effect of Wetting Characteristics of Polishing Fluid on the Quality of Water-Dissolution Polishing of KDP Crystals by Xu Wang, Hang Gao, Qianfa Deng, Jinhu Wang, Hongyu Chen, Julong Yuan

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Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer by Tianchen Zhao, Qianfa Deng, Cheng Zhang, Kaiping Feng, Zhaozhong Zhou, Julong Yuan

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Research on Abrasive Water Jet Polishing of Silicon Carbide Based on Fluid Self-Excited Oscillation Pulse Characteristics by Hong Zhang, Baochun Tao, Qianfa Deng, Chengqi Zhang, Binghai Lyu, Duc-Nam Nguyen

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Preparation of Cemented Carbide Insert Cutting Edge by Flexible Fiber-Assisted Shear Thickening Polishing Method by Lanying Shao, Yu Zhou, Wei Fang, Jiahuan Wang, Xu Wang, Qianfa Deng, Binghai Lyu

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CMP Pad Conditioning Using the High-Pressure Micro-Jet Method by Xin Li, Yinggang Wang, Hongyu Chen, Wenhong Zhao, Qianfa Deng, Tengfei Yin, Suet To, Zhe Sun, Xi Shen, Wei Hang, Julong Yuan

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