Showing 1 - 3 results of 3 for search 'Qianfa Liu', query time: 0.02s Refine Results
  1. 1
    Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging

    Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging by Zeming Fang, Xiaowei Wu, Xiaotao Zhu, Cheng Luo, Dan Li, Qianfa Liu, Ke Wang

    Published 2024-01-01
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    Article
  2. 2
    Effects of Peroxide Initiator on the Structure and Properties of Ultralow Loss Thermosetting Polyphenylene Oxide-Based Composite

    Effects of Peroxide Initiator on the Structure and Properties of Ultralow Loss Thermosetting Polyphenylene Oxide-Based Composite by Xueyi Yu, Zeming Fang, Qianfa Liu, Dan Li, Yundong Meng, Cheng Luo, Ke Wang, Zhiyong Lin

    Published 2022-04-01
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    Article
  3. 3
    Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications

    Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications by Ke Zheng, Yizhi Zhang, Jiaxiang Qiu, Guanqun Xie, Zengbiao Huang, Wei Lin, Zhimeng Liu, Qianfa Liu, Xiaoxia Wang

    Published 2024-02-01
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    Article

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