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    Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model

    Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model by Xiaoting Luo, Zhiheng Huang, Shuanjin Wang, Min Xiao, Yuezhong Meng, Hui Yan, Qizhuo Li, Gang Wang

    Published 2022-01-01
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