A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation by Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, Andre Zimmermann

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Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB by Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, Andre Zimmermann

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An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages by Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, André Zimmermann

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Investigation of a Finite-Difference-Method based real-time viscous heating compensation in a nozzle viscometer for inline viscosity measurement of phenol resins by Peter Wappler, M.Sc., Romit Kulkarni, Thomas Guenther, Serhat Sahakalkan, Karl-Peter Fritz, André Zimmermann

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Open-Eco-Innovation for SMEs with Pan-European Key Enabling Technology Centres by Faruk Civelek, Romit Kulkarni, Karl-Peter Fritz, Tanja Meyer, Costas Troulos, Thomas Guenther, André Zimmermann

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Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds by Mehmet Haybat, Thomas Guenther, Romit Kulkarni, Serhat Sahakalkan, Tobias Grözinger, Thilo Rothermel, Sascha Weser, André Zimmermann

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