Showing 1 - 4 results of 4 for search 'Sanghyeon Baeg', query time: 0.04s Refine Results
  1. 1
    DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

    DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball by Muhammad Waqar, Geunyong Bak, Junhyeong Kwon, Sanghyeon Baeg

    Published 2021-06-01
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  2. 2
    DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

    DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package by Muhammad Waqar, Geunyong Bak, Junhyeong Kwon, Sanghyeon Baeg

    Published 2021-01-01
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    Article
  3. 3
    Temperature Estimation of HBM2 Channels with Tail Distribution of Retention Errors in FPGA-HBM2 Platform

    Temperature Estimation of HBM2 Channels with Tail Distribution of Retention Errors in FPGA-HBM2 Platform by Junhyeong Kwon, Shi-Jie Wen, Rita Fung, Sanghyeon Baeg

    Published 2022-12-01
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  4. 4
    Exploitations of Multiple Rows Hammering and Retention Time Interactions in DRAM Using X-Ray Radiation

    Exploitations of Multiple Rows Hammering and Retention Time Interactions in DRAM Using X-Ray Radiation by Donghyuk Yun, Myungsang Park, Geunyong Bak, Sanghyeon Baeg, Shi-Jie Wen

    Published 2021-01-01
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    Article

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