Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist by Florian Janek, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt, André Zimmermann

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Feasibility Study of an Automated Assembly Process for Ultrathin Chips by Florian Janek, Ebru Saller, Ernst Müller, Thomas Meißner, Sascha Weser, Maximilian Barth, Wolfgang Eberhardt, André Zimmermann

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Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds by Mehmet Haybat, Thomas Guenther, Romit Kulkarni, Serhat Sahakalkan, Tobias Grözinger, Thilo Rothermel, Sascha Weser, André Zimmermann

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Flexural Fatigue Test—A Proposed Method to Characterize the Lifetime of Conductor Tracks on Polymeric Substrates by Simon Petillon, Andrea Knöller, Philipp Bräuer, David Helm, Tobias Grözinger, Sascha Weser, Wolfgang Eberhardt, Jörg Franke, André Zimmermann

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Injection Molding of Encapsulated Diffractive Optical Elements by Stefan Wagner, Kevin Treptow, Sascha Weser, Marc Drexler, Serhat Sahakalkan, Wolfgang Eberhardt, Thomas Guenther, Christof Pruss, Alois Herkommer, André Zimmermann

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