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Development of Virtual Metrology Using Plasma Information Variables to Predict Si Etch Profile Processed by SF<sub>6</sub>/O<sub>2</sub>/Ar Capacitively Coupled Plasma by Ji-Won Kwon, Sangwon Ryu, Jihoon Park, Haneul Lee, Yunchang Jang, Seolhye Park, Gon-Ho Kim
Published 2021-06-01
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