FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation by Seonho Seok

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Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” by Seonho Seok

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Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation by Seonho Seok

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Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation by Seonho Seok, HyungDal Park, Jinseok Kim

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Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe by Seonho Seok, HyungDal Park, Jinseok Kim

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Autonomous Energy Harvester Based on Textile-Based Enzymatic Biofuel Cell for On-Demand Usage by Seonho Seok, Cong Wang, Elie Lefeuvre, Jungyul Park

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A Study on Millimetre-Wave Tunable Bandpass Filter Based on Polymer Cap Deflection by Paul-Alain Rolland, Nathalie Rolland, Janggil Kim, Seonho Seok

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Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties by Seonho Seok, HyungDal Park, Philippe Coste, Jinseok Kim

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Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package by Seonho Seok, HyungDal Park, Yong-Jun Kim, Jinseok Kim

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High-Porosity Sieve-Type Neural Electrodes for Motor Function Recovery and Nerve Signal Acquisition by Wonsuk Choi, HyungDal Park, Seonghwan Oh, Seonho Seok, Dae Sung Yoon, Jinseok Kim

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A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation by HyungDal Park, Wonsuk Choi, Seonghwan Oh, Yong-Jun Kim, Seonho Seok, Jinseok Kim

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