Impact of Resin Content on Swelling Pressure of Three Layer Perticleboard Bonded with Urea-Formaldehyde Adhesive by Sergej Medved, Alan Antonović, Vladimir Jambreković

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The dynamics of thickness swelling and bond strength loss of different wood-based panels at exposure to humid climate and immersion into water by Sergej Medved, Damjan Žgajner, Alan Antonović

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Alien Wood Species as a Resource for Wood-Plastic Composites by Sergej Medved, Daša Krapež Tomec, Angela Balzano, Maks Merela

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Properties and Emissions of Three-Layer Particleboards Manufactured with Mixtures of Wood Chips and Partially Liquefied Bark by Wen Jiang, Stergios Adamopoulos, Reza Hosseinpourpia, Thomas Walther, Sergej Medved

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Thermal conductivity of different bio-based insulation materials by Sergej Medved, Eugenia Mariana Tudor, Marius Catalin Barbu, Timothy M. Young

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Utilization of Partially Liquefied Bark for Production of Particleboards by Wen Jiang, Stergios Adamopoulos, Reza Hosseinpourpia, Jure Žigon, Marko Petrič, Milan Šernek, Sergej Medved

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Evaluation of Two Ultrasonic Methods for Preparing Urea-Formaldehyde Adhesives with Nano-SiO2 by Milanka DJIPOROVIĆ-MOMČILOVIĆ, Ivana GAVRILOVIĆ-GRMUŠA, Tijana TODOROVIĆ, Mladjan POPOVIĆ, Sergej MEDVED, Jasmina POPOVIĆ, Fadhil HAMID

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Particleboards Bonded by an Imidazole-Based Adhesive System by Alexander Scharf, Carmen-Mihaela Popescu, Henric Dernegård, Johan Oja, Graham Ormondroyd, Sergej Medved, Dick Sandberg, Dennis Jones

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