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    Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)

    Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion) by Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM

    Published 2017-08-01
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