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  1. 1
    3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application

    3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application by Shunqi Yang, Ri Chen, Fu Huang, Wenxia Wang, Igor Zhitomirsky

    Published 2024-10-01
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    Article
  2. 2
    One-Step Fabrication of 2.5D CuMoO<sub>x</sub> Interdigital Microelectrodes Using Numerically Controlled Electric Discharge Machining for Coplanar Micro-Supercapacitors

    One-Step Fabrication of 2.5D CuMoO<sub>x</sub> Interdigital Microelectrodes Using Numerically Controlled Electric Discharge Machining for Coplanar Micro-Supercapacitors by Shunqi Yang, Ri Chen, Fu Huang, Wenxia Wang, Igor Zhitomirsky

    Published 2024-10-01
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    Article

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