Showing 1 - 6 results of 6 for search 'Siah, Yu Wen', query time: 0.04s Refine Results
  1. 1
    Failure analysis of tamper resistant materials for IC packaging

    Failure analysis of tamper resistant materials for IC packaging by Siah, Yu Wen

    Published 2019
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    Thesis
  2. 2
    Cu metallization and dielectric removal for failure analysis of ICs

    Cu metallization and dielectric removal for failure analysis of ICs by Siah, Yu Wen.

    Published 2012
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    Final Year Project (FYP)
  3. 3
    Laser focus depth adaptation for decapsulation of copper wirebonded devices

    Laser focus depth adaptation for decapsulation of copper wirebonded devices by Kor, Katherine Hwee Boon, Liu, Qing, Siah, Yu Wen, Gan, Chee Lip

    Published 2015
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    Conference Paper
  4. 4
    Decapsulation of 3D multi-die stacked package

    Decapsulation of 3D multi-die stacked package by Kor, Katherine Hwee Boon, Liu, Q., Siah, Yu Wen, Gan, Chee Lip

    Published 2020
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    Conference Paper
  5. 5
    Uniform delayering of copper metallization

    Uniform delayering of copper metallization by Siah, Yu Wen, Hong, Y. J., Liu, Q., Kor, Katherine Hwee Boon, Gan, C. L.

    Published 2020
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    Conference Paper
  6. 6
    Descrambling of embedded SRAM using a laser probe

    Descrambling of embedded SRAM using a laser probe by Chef, Samuel, Chua, Chung Tah, Tay, Jing Yun, Siah, Yu Wen, Bhasin, Shivam, Breier, J., Gan, Chee Lip

    Published 2019
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    Conference Paper

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