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  1. 1
    Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

    Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules by Kim S.S., Son I., Kim K.T.

    Published 2017-06-01
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    Article
  2. 2
    Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process

    Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process by Park S.H., Kim D.B., Lee R.G., Son I.J.

    Published 2017-06-01
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    Article

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