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  1. 1
    Micro connector for high packaging density fabricated by using UV Thick Photoresist

    Micro connector for high packaging density fabricated by using UV Thick Photoresist by Unno, Toshinori, Toriyama, Toshiyuki, Bhuiyan, Moinul, Yokoyama, Yoshihiko, Sugiyama, Susumu

    Published 2002
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  2. 2
    CO2 emissions for concrete bore piling construction

    CO2 emissions for concrete bore piling construction by Nik Yahya, Nik Nurul Hidayah, Mohd. Din, Shamzani Affendy, Abdullah, Alias, T., Sugiyama, Hadi, Purwanto

    Published 2015
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