Showing 1 - 2 results of 2 for search 'Tadakazu MIYASHITA', query time: 0.03s Refine Results
  1. 1
    High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates

    High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates by Yasuhisa SANO, Kousuke SHIOZAWA, Toshiro DOI, Syuhei KUROKAWA, Hideo AIDA, Tadakazu MIYASHITA, Kazuto YAMAUCHI

    Published 2016-01-01
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    Article
  2. 2
    Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bowl feed method)

    Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bow... by Toshiro K. DOI, Kiyoshi SESHIMO, Tsutomu YAMAZAKI, Masanori OHTSUBO, Hideaki NISHIZAWA, Sachi MURAKAMI, Daizo ICHIKAWA, Yoshio NAKAMURA, Tadakazu MIYASHITA, Yoshihide KAWAMURA, Masataka TAKAGI, Hiroshi KASHIWADA, Hideo AIDA

    Published 2015-02-01
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    Article

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