Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$ SiO 2 by Kai Takeuchi, Tadatomo Suga, Eiji Higurashi

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Evidence for intermolecular forces involved in ladybird beetle tarsal setae adhesion by Naoe Hosoda, Mari Nakamoto, Tadatomo Suga, Stanislav N. Gorb

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Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg−Zn−Ca alloy by Hui Fang, Chenxi Wang, Shicheng Zhou, Ge Li, Yanhong Tian, Tadatomo Suga

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Low temperature Cu bonding with large tolerance of surface oxidation by Hui Ren, Fengwen Mu, Seongbin Shin, Lei Liu, Guisheng Zou, Tadatomo Suga

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Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration by Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy Buschbeck

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A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature by Junlong Li, Yang Xu, Ying Meng, Zhen Yin, Xuelong Zhao, Yinghui Wang, Tadatomo Suga

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Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag₂O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor by Liangliang He, Junlong Li, Xin Wu, Fengwen Mu, Yinghui Wang, Yangting Lu, Tadatomo Suga

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Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

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Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Seiichi Takamatsu, Toshihiro Itoh, Eiji Higurashi

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Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor by Fengwen Mu, Yang Xu, Seongbin Shin, Yinghui Wang, Hengyu Xu, Haiping Shang, Yechao Sun, Lei Yue, Tatsurou Tsuyuki, Tadatomo Suga, Weibing Wang, Dapeng Chen

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Efficient thermal dissipation in wafer-scale heterogeneous integration of single-crystalline β-Ga2O3 thin film on SiC by Wenhui Xu, Tiangui You, Yibo Wang, Zhenghao Shen, Kang Liu, Lianghui Zhang, Huarui Sun, Ruijie Qian, Zhenghua An, Fengwen Mu, Tadatomo Suga, Genquan Han, Xin Ou, Yue Hao, Xi Wang

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