Showing 1 - 2 results of 2 for search 'Tadepalli, Rajappa, 1979-', query time: 0.02s Refine Results
  1. 1
    Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits

    Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits by Tadepalli, Rajappa, 1979-

    Published 2007
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    Thesis
  2. 2
    Characterization of bonded copper interconnects for three-dimensional integrated circuits

    Characterization of bonded copper interconnects for three-dimensional integrated circuits by Tadepalli, Rajappa, 1979-

    Published 2005
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    Thesis

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